DIGITAL-JU-CHIPS-2026-SG-JAPAN

Πηγή: EU Funds

📅 Λήξη υποβολής: 24/09/2026
📍 Περιφέρειες: Όλη η Ελλάδα

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International collaboration EU and Japan on semiconductors <div class="eui-u-mt-l>"><h4>Conditions</h4><div><h4>1. Admissibility conditions: Proposal page limit and layout</h4><div class="eui-u-mt-s"><p>described in <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u> <u>call document</u>.</p><p><strong>Proposal page limits and layout:</strong> described in Part B of the Application Form available in the Submission System.</p></div></div><div><h4>2. Eligible countries</h4><div class="eui-u-mt-s"><p>described in <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>3. Other eligibility conditions</h4><div class="eui-u-mt-s"><p><u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>4. Financial and operational capacity and exclusion</h4><div class="eui-u-mt-s"><p>described <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>5a. Evaluation and award: Submission and evaluation processes</h4><div class="eui-u-mt-s"><p>described <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u> and the <a href="https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/common/guidance/om_en.pdf" rel="noopener noreferrer" target="_blank">Online Manual</a>.</p></div></div><div><h4>5b. Evaluation and award: Award criteria, scoring and thresholds</h4><div class="eui-u-mt-s"><p>described <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>5c. Evaluation and award: Indicative timeline for evaluation and grant agreement</h4><div class="eui-u-mt-s"><p>described in <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>6. Legal and financial set-up of the grants</h4><div class="eui-u-mt-s"><p>described <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div></div><div class="eui-u-mt-l"><div class="eui-u-mt-s"><p><a href="https://www.chips-ju.europa.eu/Call-Details/?id=a1c5feaf-d070-f111-ab0e-000d3ab6c0a4" rel="noopener noreferrer" target="_blank">Call Details</a></p></div><h4>Call document and annexes:</h4> <div class="eui-u-mt-s"><p><strong>Model Grant Agreements (MGA)</strong></p><p><a href="https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/digital/agr-contr/mga_dep_en.pdf" rel="noopener noreferrer" target="_blank">DEP MGA</a></p></div><h4>Additional documents:</h4> <div class="eui-u-mt-s"><p><a href="https://eur-lex.europa.eu/legal-content/EN/ALL/?uri=CELEX:32021R0694" rel="noopener noreferrer" target="_blank">DEP Regulation 2021/964</a></p><p><a href="https://eur-lex.europa.eu/legal-content/EN/ALL/?uri=OJ:L_202402509" rel="noopener noreferrer" target="_blank">EU Financial Regulation 2024/2509</a></p><p><a href="https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/common/guidance/aga_en.pdf" rel="noopener noreferrer" target="_blank">EU Grants AGA — Annotated Model Grant Agreement</a> </p><p><a href="https://webgate.ec.europa.eu/funding-tenders-opportunities/display/OM/Online+Manual" rel="noopener noreferrer" target="_blank">Funding &amp; Tenders Portal Online Manual</a> </p><p><a href="https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/common/ftp/tc_en.pdf" rel="noopener noreferrer" target="_blank">Funding &amp; Tenders Portal Terms and Conditions</a> </p><p><a href="https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/support/legalnotice" rel="noopener noreferrer" target="_blank">Funding &amp; Tenders Portal Privacy Statement</a></p></div></div>
📄 Πλήρες κείμενο πρόσκλησης (5k χαρακτήρες)
Home Funding Calls for proposals International collaboration EU and Japan on semiconductors International collaboration EU and Japan on semiconductors DIGITAL-JU-CHIPS-2026-SG-JAPAN Topic Call for proposal Internal navigation General information Topic description Topic updates Conditions and documents Budget overview Partner search announcements Start submission Topic Q&As Get support General information Programme Digital Europe Programme (DIGITAL) Call DIGITAL-JU-CHIPS-2026-SG-JAPAN (DIGITAL-JU-CHIPS-2026-SG-JAPAN) Type of action DIGITAL-JU-SIMPLE DIGITAL JU Simple Grants Type of MGA DIGITAL Action Grant Budget-Based [DIGITAL-AG] Open For Submission Deadline model single-stage Opening date 07 July 2026 Deadline date 24 September 2026 17:00:00 Brussels time Topic description Expected Outcome: Projects are expected to contribute to the following expected outcomes: Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities. Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem Expected outcomes should have direct and immediate impact on European industry. Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events. Show more Topic updates 07 July 2026 The submission session is now available for: DIGITAL-JU-CHIPS-2026-SG-JAPAN Show more Topic conditions and documents Conditions 1. Admissibility conditions: Proposal page limit and layout described in Appendix 8 of Work Programme - Chips for Europe Initiative call document. Proposal page limits and layout: described in Part B of the Application Form available in the Submission System. 2. Eligible countries described in Appendix 8 of Work Programme - Chips for Europe Initiative. 3. Other eligibility conditions Appendix 8 of Work Programme - Chips for Europe Initiative. 4. Financial and operational capacity and exclusion described Appendix 8 of Work Programme - Chips for Europe Initiative. 5a. Evaluation and award: Submission and evaluation processes described Appendix 8 of Work Programme - Chips for Europe Initiative and the Online Manual. 5b. Evaluation and award: Award criteria, scoring and thresholds described Appendix 8 of Work Programme - Chips for Europe Initiative. 5c. Evaluation and award: Indicative timeline for evaluation and grant agreement described in Appendix 8 of Work Programme - Chips for Europe Initiative. 6. Legal and financial set-up of the grants described Appendix 8 of Work Programme - Chips for Europe Initiative. Call Details Call document and annexes: Model Grant Agreements (MGA) DEP MGA Additional documents: DEP Regulation 2021/964 EU Financial Regulation 2024/2509 EU Grants AGA — Annotated Model Grant Agreement Funding & Tenders Portal Online Manual Funding & Tenders Portal Terms and Conditions Funding & Tenders Portal Privacy Statement Show more Budget overview Topic Budget year : 2026 Stages Opening date Deadline Contributions Indicative number of grants DIGITAL-JU-CHIPS-2026-SG-JAPAN - DIGITAL-JU-SIMPLE DIGITAL JU Simple Grants 5 000 000,00 € Single-stage 7 July 2026 24 September 2026 3 000 000,00 € to 5 000 000,00 € 2 Items per page: 10 50 100 Showing 1–1 of 1 Partner search announcements 18 Searches of partners to collaborate on this topic View / Edit LEARs, Account Administrators or self-registrants can publish partner requests for open and forthcoming topics after logging into this Portal, as well as any user having an active public Person profile. Start submission Need help? To access the Electronic Submission Service, please click on the submission-button next to the type of action and the type of model grant agreement that corresponds to your proposal. You will then be asked to confirm your choice, as it cannot be changed in the submission system. Upon confirmation, you will be linked to the correct entry point. To access existing draft proposals for this topic, please login to the Funding & Tenders Portal and select the My Proposals page of the My Area section. Please select the type of your submission: DIGITAL JU Simple Grants [DIGITAL-JU-SIMPLE], DIGITAL Action Grant Budget-Based [DIGITAL-AG] Start submission Topic Q&As0 item(s) found General FAQ Get support Please read carefully all provisions below before the preparation of your application. For help related to this call, please contact: Calls@chips-ju.europa.eu Funding & Tenders Portal FAQ – Submission of proposals. IT Helpdesk – Contact the IT helpdesk for questions such as forgotten passwords, access rights and roles, technical aspects of submission of proposals, etc. Online Manual – Step-by-step online guide through the Portal processes from proposal preparation and evaluation to reporting on your ongoing project. Valid for all 2021-2027 programmes.

Επίσημη πηγή: EU Funds

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Τελευταία ενημέρωση: 25/08/2026