DIGITAL-JU-CHIPS-2026-SG-JAPAN

International collaboration EU and Japan on semiconductors <div class="eui-u-mt-l>"><h4>Conditions</h4><div><h4>1. Admissibility conditions: Proposal page limit and layout</h4><div class="eui-u-mt-s"><p>described in <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u> <u>call document</u>.</p><p><strong>Proposal page limits and layout:</strong> described in Part B of the Application Form available in the Submission System.</p></div></div><div><h4>2. Eligible countries</h4><div class="eui-u-mt-s"><p>described in <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>3. Other eligibility conditions</h4><div class="eui-u-mt-s"><p><u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>4. Financial and operational capacity and exclusion</h4><div class="eui-u-mt-s"><p>described <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>5a. Evaluation and award: Submission and evaluation processes</h4><div class="eui-u-mt-s"><p>described <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u> and the <a href="https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/common/guidance/om_en.pdf" rel="noopener noreferrer" target="_blank">Online Manual</a>.</p></div></div><div><h4>5b. Evaluation and award: Award criteria, scoring and thresholds</h4><div class="eui-u-mt-s"><p>described <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>5c. Evaluation and award: Indicative timeline for evaluation and grant agreement</h4><div class="eui-u-mt-s"><p>described in <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>6. Legal and financial set-up of the grants</h4><div class="eui-u-mt-s"><p>described <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div></div><div class="eui-u-mt-l"><div class="eui-u-mt-s"><p><a href="https://www.chips-ju.europa.eu/Call-Details/?id=a1c5feaf-d070-f111-ab0e-000d3ab6c0a4" rel="noopener noreferrer" target="_blank">Call Details</a></p></div><h4>Call document and annexes:</h4> <div class="eui-u-mt-s"><p><strong>Model Grant Agreements (MGA)</strong></p><p><a href="https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/digital/agr-contr/mga_dep_en.pdf" rel="noopener noreferrer" target="_blank">DEP MGA</a></p></div><h4>Additional documents:</h4> <div class="eui-u-mt-s"><p><a href="https://eur-lex.europa.eu/legal-content/EN/ALL/?uri=CELEX:32021R0694" rel="noopener noreferrer" target="_blank">DEP Regulation 2021/964</a></p><p><a href="https://eur-lex.europa.eu/legal-content/EN/ALL/?uri=OJ:L_202402509" rel="noopener noreferrer" target="_blank">EU Financial Regulation 2024/2509</a></p><p><a href="https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/common/guidance/aga_en.pdf" rel="noopener noreferrer" target="_blank">EU Grants AGA — Annotated Model Grant Agreement</a> </p><p><a href="https://webgate.ec.europa.eu/funding-tenders-opportunities/display/OM/Online+Manual" rel="noopener noreferrer" target="_blank">Funding &amp; Tenders Portal Online Manual</a> </p><p><a href="https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/common/ftp/tc_en.pdf" rel="noopener noreferrer" target="_blank">Funding &amp; Tenders Portal Terms and Conditions</a> </p><p><a href="https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/support/legalnotice" rel="noopener noreferrer" target="_blank">Funding &amp; Tenders Portal Privacy Statement</a></p></div></div>