DIGITAL-JU-CHIPS-2026-SG-JAPAN
Πηγή: EU Funds
📅 Λήξη υποβολής: 24/09/2026
📍 Περιφέρειες: Όλη η Ελλάδα
📋 Σε λίγα λόγια
Το πρόγραμμα αφορά τη διεθνή συνεργασία μεταξύ ΕΕ και Ιαπωνίας στον τομέα των ημιαγωγών. Δικαιούχοι είναι οι χώρες που συμμετέχουν στο πρόγραμμα και μπορούν να λάβουν χρηματοδότηση, αν και δεν αναφέρεται συγκεκριμένο ποσό ή ποσοστό. Η προθεσμία υποβολής λήγει σε μια ημερομηνία που δεν αναφέρεται, και το βασικό όφελος για τους δικαιούχους είναι η ενίσχυση της τεχνολογικής τους ικανότητας.
Η περίληψη δημιουργήθηκε με τεχνητή νοημοσύνη (AI) — ελέγξτε πάντα την επίσημη πρόσκληση.
Περιγραφή προγράμματος
International collaboration EU and Japan on semiconductors
<div class="eui-u-mt-l>"><h4>Conditions</h4><div><h4>1. Admissibility conditions: Proposal page limit and layout</h4><div class="eui-u-mt-s"><p>described in <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u> <u>call document</u>.</p><p><strong>Proposal page limits and layout:</strong> described in Part B of the Application Form available in the Submission System.</p></div></div><div><h4>2. Eligible countries</h4><div class="eui-u-mt-s"><p>described in <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>3. Other eligibility conditions</h4><div class="eui-u-mt-s"><p><u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>4. Financial and operational capacity and exclusion</h4><div class="eui-u-mt-s"><p>described <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>5a. Evaluation and award: Submission and evaluation processes</h4><div class="eui-u-mt-s"><p>described <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u> and the <a href="https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/common/guidance/om_en.pdf" rel="noopener noreferrer" target="_blank">Online Manual</a>.</p></div></div><div><h4>5b. Evaluation and award: Award criteria, scoring and thresholds</h4><div class="eui-u-mt-s"><p>described <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>5c. Evaluation and award: Indicative timeline for evaluation and grant agreement</h4><div class="eui-u-mt-s"><p>described in <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>6. Legal and financial set-up of the grants</h4><div class="eui-u-mt-s"><p>described <u><a href="https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474" rel="noopener noreferrer" target="_blank">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div></div><div class="eui-u-mt-l"><div class="eui-u-mt-s"><p><a href="https://www.chips-ju.europa.eu/Call-Details/?id=a1c5feaf-d070-f111-ab0e-000d3ab6c0a4" rel="noopener noreferrer" target="_blank">Call Details</a></p></div><h4>Call document and annexes:</h4> <div class="eui-u-mt-s"><p><strong>Model Grant Agreements (MGA)</strong></p><p><a href="https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/digital/agr-contr/mga_dep_en.pdf" rel="noopener noreferrer" target="_blank">DEP MGA</a></p></div><h4>Additional documents:</h4> <div class="eui-u-mt-s"><p><a href="https://eur-lex.europa.eu/legal-content/EN/ALL/?uri=CELEX:32021R0694" rel="noopener noreferrer" target="_blank">DEP Regulation 2021/964</a></p><p><a href="https://eur-lex.europa.eu/legal-content/EN/ALL/?uri=OJ:L_202402509" rel="noopener noreferrer" target="_blank">EU Financial Regulation 2024/2509</a></p><p><a href="https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/common/guidance/aga_en.pdf" rel="noopener noreferrer" target="_blank">EU Grants AGA — Annotated Model Grant Agreement</a> </p><p><a href="https://webgate.ec.europa.eu/funding-tenders-opportunities/display/OM/Online+Manual" rel="noopener noreferrer" target="_blank">Funding & Tenders Portal Online Manual</a> </p><p><a href="https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/common/ftp/tc_en.pdf" rel="noopener noreferrer" target="_blank">Funding & Tenders Portal Terms and Conditions</a> </p><p><a href="https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/support/legalnotice" rel="noopener noreferrer" target="_blank">Funding & Tenders Portal Privacy Statement</a></p></div></div>
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International collaboration EU and Japan on semiconductors
International collaboration EU and Japan on semiconductors
DIGITAL-JU-CHIPS-2026-SG-JAPAN
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General information
Programme
Digital Europe Programme (DIGITAL)
Call
DIGITAL-JU-CHIPS-2026-SG-JAPAN (DIGITAL-JU-CHIPS-2026-SG-JAPAN)
Type of action
DIGITAL-JU-SIMPLE DIGITAL JU Simple Grants
Type of MGA
DIGITAL Action Grant Budget-Based [DIGITAL-AG]
Open For Submission
Deadline model
single-stage
Opening date
07 July 2026
Deadline date
24 September 2026 17:00:00 Brussels time
Topic description
Expected Outcome:
Projects are expected to contribute to the following expected outcomes:
Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.
Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem
Expected outcomes should have direct and immediate impact on European industry.
Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.
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Topic updates
07 July 2026
The submission session is now available for: DIGITAL-JU-CHIPS-2026-SG-JAPAN
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Topic conditions and documents
Conditions
1. Admissibility conditions: Proposal page limit and layout
described in Appendix 8 of Work Programme - Chips for Europe Initiative call document.
Proposal page limits and layout: described in Part B of the Application Form available in the Submission System.
2. Eligible countries
described in Appendix 8 of Work Programme - Chips for Europe Initiative.
3. Other eligibility conditions
Appendix 8 of Work Programme - Chips for Europe Initiative.
4. Financial and operational capacity and exclusion
described Appendix 8 of Work Programme - Chips for Europe Initiative.
5a. Evaluation and award: Submission and evaluation processes
described Appendix 8 of Work Programme - Chips for Europe Initiative and the Online Manual.
5b. Evaluation and award: Award criteria, scoring and thresholds
described Appendix 8 of Work Programme - Chips for Europe Initiative.
5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
described in Appendix 8 of Work Programme - Chips for Europe Initiative.
6. Legal and financial set-up of the grants
described Appendix 8 of Work Programme - Chips for Europe Initiative.
Call Details
Call document and annexes:
Model Grant Agreements (MGA)
DEP MGA
Additional documents:
DEP Regulation 2021/964
EU Financial Regulation 2024/2509
EU Grants AGA — Annotated Model Grant Agreement
Funding & Tenders Portal Online Manual
Funding & Tenders Portal Terms and Conditions
Funding & Tenders Portal Privacy Statement
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Budget overview
Topic
Budget year : 2026
Stages
Opening date
Deadline
Contributions
Indicative number of grants
DIGITAL-JU-CHIPS-2026-SG-JAPAN - DIGITAL-JU-SIMPLE DIGITAL JU Simple Grants
5 000 000,00 € Single-stage 7 July 2026
24 September 2026
3 000 000,00 € to 5 000 000,00 €
2
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DIGITAL JU Simple Grants [DIGITAL-JU-SIMPLE], DIGITAL Action Grant Budget-Based [DIGITAL-AG]
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