HORIZON-JU-CHIPS-2026-FT1-IA

Home Funding Calls for proposals IA Resilience call reinforcing Europe's strenght in power electronics IA Resilience call reinforcing Europe's strenght in power electronics HORIZON-JU-CHIPS-2026-FT1-IA Topic Call for proposal Internal navigation General information Topic description Topic updates Conditions and documents Budget overview Partner search announcements Start submission Topic Q&As Get support General information Programme Horizon Europe (HORIZON) Call HORIZON-JU-CHIPS-2026-FT1-IA (HORIZON-JU-CHIPS-2026-FT1-IA) Type of action HORIZON-JU-IA HORIZON JU Innovation Actions Type of MGA HORIZON Action Grant Budget-Based [HORIZON-AG] Open For Submission Deadline model single-stage Opening date 07 July 2026 Deadline date 16 September 2026 17:00:00 Brussels time Topic description Scope: Proposals innovations should address one or more of the several domains : WBG substrates to reduce EU dependency on material and provide more sustainable, industrially compatible solutions. WBG platform for cost effectiveness, available in 300mm for GaN and/or SiC to improve yield and power density and close gaps in the value chain. A toolbox (e.g. wafer cut, smart stacking, thin layer transfer, epitaxy, UWBG materials) for further innovation schemes. Next generation or optimised new power semiconductor devices fitting their application. Adding intelligence to power semiconductor devices on control and/or sensor side. Facilitate the propagation of EU Packaging/Integration excellence along the entire value chain e.g. pre-packages or power semiconductor device packaging solutions to enable power device/system integration and strengthen Europe’s competitiveness in advanced packaging. Explore the use of heterogeneous and functional integration for improved performance, reliability, robustness and cost competitiveness. Rising operative voltage, frequency, current and thermal features that are common challenge on power electronics across the different application sectors. Provide stable and clean power supply that minimises disruptions, equipment failures, and data corruption. Advanced characterization techniques for new materials, devices, and systems. Implement AI at system level and/or make use of AI methods to increase the innovation speed. Show more Topic updates 07 July 2026 The submission session is now available for: HORIZON-JU-CHIPS-2026-FT1-IA Show more Topic conditions and documents General conditions 1. Admissibility conditions: Proposal page limit and layout Proposal page limits and layout: detailed in Part B of the Application Form, which you can access from the Call documents section on the Chips JU website's Call page The following information are all described in the Appendix 7 of the Chips JU Workprogramme 2. Eligible countries 3. Other Eligibility Conditions 4. Financial and operational capacity and exclusion 5a. Evaluation and award: Award criteria, scoring and thresholds 5b. Evaluation and award: Submission and evaluation processes 5c. Evaluation and award: Indicative timeline for evaluation and grant agreement 6. Legal and financial set-up of the grants Specific conditions Please visit the Chips JU website's Call page Calls documents Please refer to the calls documents section on the Chips JU website's Call page to view and download all required documents and templates. Specific documents 2026 Guide for Applicants RIA_IA_FT-FPP Evaluation Form Chips IA RIA FT-FPP Template Application form Part B IA-RIA-FT FPP Ownership Control Declaration form template National Budgets Table template (xls) General documents Chips JU Multiannual Work Programme Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 PAB decision on the evaluation and selection procedures related to Calls for Proposals ECS Strategic Research and Innovation Agenda Rules for legal entity validation, LEAR appointment, financial capacity and ownership control assessment Annotated Model Grant Agreement for EU Funding Programmes 2021-2027 Application and evaluation forms and model grant agreement (MGA): Model Grant Agreements (MGA) HE MGA Call-specific instructions Information on financial support to third parties (HE) Information on clinical studies (HE) Additional documents: EU Financial Regulation 2024/2509 EU Grants AGA — Annotated Model Grant Agreement Funding & Tenders Portal Online Manual Funding & Tenders Portal Terms and Conditions Funding & Tenders Portal Privacy Statement Show more Budget overview Topic Budget year : 2026 Stages Opening date Deadline Contributions Indicative number of grants HORIZON-JU-CHIPS-2026-FT1-IA - HORIZON-JU-IA HORIZON JU Innovation Actions 20 000 000,00 € Single-stage 7 July 2026 16 September 2026 1 000 000,00 € to 10 000 000,00 € 2 Items per page: 10 50 100 Showing 1–1 of 1 Partner search announcements 23 Searches of partners to collaborate on this topic View / Edit LEARs, Account Administrators or self-registrants can publish partner requests for open and forthcoming topics after logging into this Portal, as well as any user having an active public Person profile. Start submission Need help? To access the Electronic Submission Service, please click on the submission-button next to the type of action and the type of model grant agreement that corresponds to your proposal. You will then be asked to confirm your choice, as it cannot be changed in the submission system. Upon confirmation, you will be linked to the correct entry point. To access existing draft proposals for this topic, please login to the Funding & Tenders Portal and select the My Proposals page of the My Area section. Please select the type of your submission: HORIZON JU Innovation Actions [HORIZON-JU-IA], HORIZON Action Grant Budget-Based [HORIZON-AG] Start submission Topic Q&As0 item(s) found General FAQ Get support Please read carefully all provisions below before the preparation of your application. For help related to this call, please contact calls@chips-ju.europa.eu Online Manual is your guide on the procedures from proposal submission to managing your grant. Funding & Tenders Portal FAQ – find the answers to most frequently asked questions on submission of proposals, evaluation and grant management. IT Helpdesk – contact the Funding & Tenders Portal IT helpdesk for questions such as forgotten passwords, access rights and roles, technical aspects of submission of proposals, etc. Partner Search help you find a partner organisation for your proposal.